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NTC thermistors for temperature measurement
SMD NTC thermistors, case size 0805 (2012)
Series/Type: Date:
B574**V2 February 2009
(c) EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Applications Temperature measurement and compensation Features Multilayer SMD NTC with inner electrodes Nickel barrier termination Excellent long-term aging stability in high-temperature environment Superior resistance stability during soldering (change <1%) Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request. Delivery mode Blister tape, 180-mm reel (standard); 330-mm reel (on request) General technical data Climatic category Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity
Dimensional drawing
Dimensions in mm Approx. weight 13 mg
(IEC 60068-1) (at 25 C, on PCB) P251) RR/RR TR (on PCB) th1) (on PCB) c1) Cth1)
55/125/56 210 3, 5 25 approx. 3.5 approx. 10 approx. 35
mW % C mW/K s mJ/K
1) Depends on mounting situation
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Electrical specification and ordering codes R25 100 150 220 330 470 680 1.0 k 1.5 k 2.2 k 3.3 k 4.7 k 4.7 k 6.8 k 10 k 10 k 22 k 22 k 33 k 33 k 47 k 100 k 470 k No. of R/T characteristic 8501 8501 8501 8501 8502 8502 8502 8502 8502 8502 8500 8507 8507 8502 8507 8502 8507 8502 8507 8507 8507 8507 B25/50 K 3500 3500 3500 3500 3940 3940 3940 3940 3940 3940 3590 4386 4386 3940 4386 3940 4386 3940 4386 4386 4386 4386 B25/85 K 3540 3540 3540 3540 3980 3980 3980 3980 3980 3980 3635 4455 4455 3980 4455 3980 4455 3980 4455 4455 4455 4455 B25/100 K 3550 3% 3550 3% 3550 3% 3550 3% 4000 3% 4000 3% 4000 3% 4000 3% 4000 3% 4000 3% 3650 3% 4480 3% 4480 3% 4000 3% 4480 3% 4000 3% 4480 3% 4000 3% 4480 3% 4480 3% 4480 3% 4480 3% Ordering code B57411V2101+062 B57411V2151+062 B57411V2221+062 B57411V2331+062 B57421V2471+062 B57421V2681+062 B57421V2102+062 B57421V2152+062 B57421V2222+062 B57421V2332+062 B57401V2472+062 B57471V2472+062 B57471V2682+062 B57421V2103+062 B57471V2103+062 B57421V2223+062 B57471V2223+062 B57421V2333+062 B57471V2333+062 B57471V2473+062 B57471V2104+062 B57471V2474+062
+ = Resistance tolerance H = 3% J = 5%
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Reliability data SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. Test Storage in dry heat Standard IEC 60068-2-2 JIS C 0021 Test conditions R25/R25 (typical) < 2% Remarks
Storage in damp heat, steady state
Rapid temperature cycling Endurance
Solderability
Storage at upper category temperature T: (125 2) C t: 1000 h IEC Temperature of air: (40 2) C 60068-2-78 Relative humidity of air: JIS C 0022 (93 +2/ 3)% Duration: 56 days IEC Lower test temperature: 55 C 60068-2-14 Upper test temperature: 125 C JIS C 0025 Number of cycles: 100 Pmax: 210 mW T: (65 2) C t: 1000 h IEC Solderability: 60068-2-58 (215 3) C, (3 0.3) s JIS C 0054 (235 5) C, (2 0.2) s Resistance to soldering heat: (260 5) C, (10 1) s Reflow soldering profile Wave soldering profile
< 2%
< 2%
< 2%
95% of terminations wetted
Resistance drift after soldering
< 1%
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
R/T characteristics
R/T No. T (C) 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 105.0 110.0 115.0 120.0 125.0 130.0 135.0 140.0 145.0 150.0
8500
8501
8502
B25/100 = 3650 K B25/100 = 3550 K B25/100 = 4000 K RT/R25 (%/K) RT/R25 (%/K) RT/R25 (%/K) 63.917 45.889 33.344 24.504 18.201 13.657 10.347 7.9114 6.1019 4.7454 3.7198 2.938 2.3372 1.8722 1.5096 1.2249 1.0000 0.82111 0.67798 0.56279 0.46958 0.39374 0.33171 0.28073 0.23863 0.2037 0.17459 0.15022 0.12975 0.11247 0.097838 0.085396 0.074781 0.065691 0.057883 0.051153 0.045335 0.040289 0.0359 0.032071 0.028723 0.025786 6.8 6.5 6.3 6.1 5.8 5.6 5.5 5.3 5.1 4.9 4.8 4.6 4.5 4.4 4.2 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 3.0 2.9 2.8 2.8 2.7 2.6 2.6 2.5 2.4 2.4 2.3 2.3 2.2 2.2 2.1 56.633 41.134 30.209 22.42 16.807 12.721 9.7156 7.4854 5.8152 4.5537 3.5931 2.8558 2.2857 1.8416 1.4934 1.2184 1.0000 0.82537 0.68495 0.57139 0.47905 0.40358 0.34158 0.2904 0.24795 0.21259 0.183 0.15813 0.13715 0.11938 0.10427 0.091375 0.080333 0.070846 0.062666 0.055592 0.049454 6.5 6.3 6.1 5.9 5.7 5.5 5.3 5.1 5.0 4.8 4.7 4.5 4.4 4.3 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 3.0 2.9 2.8 2.7 2.7 2.6 2.5 2.5 2.4 2.4 2.3 96.158 66.892 47.127 33.606 24.243 17.681 13.032 9.702 7.2923 5.5314 4.2325 3.2657 2.54 1.9907 1.5716 1.2494 1.0000 0.80552 0.65288 0.53229 0.43645 0.35981 0.29819 0.24837 0.20787 0.17479 0.14763 0.12523 0.10667 0.091227 0.078319 0.067488 0.058363 0.050647 0.044098 0.03852 0.033752 0.029663 0.026146 0.023111 0.020484 0.018203 7.4 7.1 6.9 6.6 6.4 6.2 6.0 5.8 5.6 5.4 5.3 5.1 4.9 4.8 4.7 4.5 4.4 4.3 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.2 3.1 3.0 2.9 2.9 2.8 2.7 2.7 2.6 2.6 2.5 2.4 2.4 2.3
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
R/T characteristics
R/T No. 8507 T (C) B25/100 = 4480 K T (C) RT/R25 (%/K) 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 5.0 10.0 142.71 96.913 66.637 46.366 32.629 23.213 16.686 12.115 8.8803 6.5692 4.9025 3.6896 2.7994 2.1406 7.9 7.6 7.4 7.1 6.9 6.7 6.5 6.3 6.1 5.9 5.8 5.6 5.4 5.3 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0
B25/100 = 4480 K T (C) RT/R25 (%/K) 1.6492 1.2798 1.0000 0.78663 0.62277 0.4961 0.39757 0.32044 0.2597 0.21161 0.17331 0.14265 0.11799 0.098035 5.1 5.0 4.9 4.7 4.6 4.5 4.4 4.3 4.1 4.0 3.9 3.8 3.8 3.7 85.0 90.0 95.0 100.0 105.0 110.0 115.0 120.0 125.0 130.0 135.0 140.0 145.0 150.0
B25/100 = 4480 K RT/R25 (%/K) 0.081823 0.068589 0.057735 0.048796 0.041403 0.035263 0.030143 0.025858 0.022258 0.019223 0.016655 0.014476 0.012619 0.011033 3.6 3.5 3.4 3.3 3.2 3.2 3.1 3.0 3.0 2.9 2.8 2.8 2.7 2.7
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Taping and packing 1 1.1 Taping of SMD NTC thermistors Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3)
Dimensions (mm) Case size 0402 (8-mm tape) A0 x B0 T2 T D0 P0 P2 P1 W E F G 0.60 x 1.15 0.70 0.60 1.50 4.00 2.00 2.00 8.00 1.75 3.50 0.75 Case size 0603 (8-mm tape) 0.95 x 1.80 1.10 0.90 1.50 4.00 2.00 4.00 8.00 1.75 3.50 0.75 Tolerance
0.2 max. max. 0.10 0.101) 0.05 0.10 0.30 0.10 0.05 min.
1) 0.2 mm over 10 sprocket holes.
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
1.2
Blister tape for case size 0805 (taping to IEC 60286-3)
Dimensions (mm) Case size 0805 (8-mm tape) A0 x B0 K0 T2 D0 D1 P0 P2 P1 W E F G 1.60 x 2.40 1.40 2.5 1.50 1.00 4.00 2.00 4.00 8.00 1.75 3.50 0.75 Tolerance
0.2 max. max. +0.10/-0 min. 0.102) 0.05 0.10 0.30 0.10 0.05 min.
2) 0.2 mm over 10 sprocket holes.
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
1.3
Reel packing
Packing survey Case size Chip 8-mm tape thickness3) mm Reel dimensions Packing units
mm Blister Card- A board Tol. 3/+0 3/+0 2.0 3/+0 2.0 W1 8.4 8.4 12.4 8.4 12.4 Tol. +1.5/ 0 +1.5/ 0 +1.5/ 0 +1.5/ 0 +1.5/ 0 W2 14.4 max. 14.4 max. 18.4 max. 14.4 max. 18.4 max.
pcs./reel 180-mm 330-mm reel reel 10000 4000 16000 4000 3000 16000 12000
0402 0603 0805
0.5 0.8 0.8 1.2 x x
x x
180 180 330 180 330
3) Chip thickness depends on the resistance value.
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Mounting instructions 1 1.1 Soldering SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB. Nickel barrier termination The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metalization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods.
Figure 1 SMD NTC thermistors, structure of nickel barrier termination 1.1.1 Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas 95%. Solder SnPb 60/40 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 1.1.2 Bath temperature (C) 215 3 245 3 Dwell time (s) 3 3
Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges 1/3. Solder SnPb 60/40 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) Bath temperature (C) 260 260 5 5 Dwell time (s) 10 10
Please read Cautions and warnings and Important notes at the end of this document.
Page 10 of 20
Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Wave soldering Temperature characteristic at component terminal with dual wave soldering
Solder joint profiles for silver/nickel/tin terminations
Please read Cautions and warnings and Important notes at the end of this document.
Page 11 of 20
Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Reflow soldering Recommended temperature characteristic for reflow soldering following J-STD-020C
Profile feature Average ramp-up rate (TSmax to Tp) Preheat - Temperature min (TSmin) - Temperature max (TSmax) - Time (tSmin to tSmax) Time maintained above: - Temperature min (TL) - Time (tL) Peak/ classification temperature (Tp) Time within 5 C of actual peak temperature (tp) Ramp-down rate Time 25 C to peak temperature
Sn-Pb eutectic assembly 3 C/ second max. 100 C 150 C 60 ... 120 seconds 183 C 60 ... 150 seconds 220 C ... 240 C 10 ... 30 seconds 6 C/ second max. 6 minutes max.
Pb-free assembly 3 C/ second max. 150 C 200 C 60 ... 180 seconds 217 C 60 ... 150 seconds 240 C ... 260 C 20 ... 40 seconds 6 C/ second max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Please read Cautions and warnings and Important notes at the end of this document.
Page 12 of 20
Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Solder joint profiles for silver/nickel/tin terminations
1.1.3
Recommended geometry of solder pads
Recommended maximum dimensions (mm) Case size inch/mm 0402/1005 0603/1608 0805/2012 1.1.4 A 0.6 1.0 1.3 B 0.6 1.0 1.2 C 1.7 3.0 3.4
Notes
Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
2
Conductive adhesion
An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Sealing and potting
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. 4 Cleaning
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are permissible. 5 Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: Relative humidity (without condensation): 25 C up to 45 C 75% annual mean
<95%, maximum 30 days per annum Solder the thermistors listed in this data book after shipment from EPCOS within the time specified: SMDs: Leaded components: 12 months 24 months
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
6
Placement and orientation of SMD NTC thermistors on PCB
a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked.
b) Cracks When placing a component near an area which is apt to bend or a grid groove on the PC board, it is advisable to have both electrodes subjected to uniform stress, or to position the component's electrodes at right angles to the grid groove or bending line (see c) Component orientation).
c) Component orientation Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Cautions and warnings General See "Important notes" at the end of this document. Storage Store thermistors only in original packaging. Do not open the package prior to storage. Storage conditions in original packaging: storage temperature 25 C ... +45 C, relative humidity 75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or components may stick together, causing problems during mounting. Avoid contamination of thermistor surface during storage, handling and processing. Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc). Use the components as soon as possible after opening the factory seals, i.e. the polyvinyl-sealed packages. Solder thermistors within the time specified after shipment from EPCOS. For leaded components this is 24 months, for SMDs 12 months. Handling NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused during handling of NTCs. Do not touch components with bare hands. Gloves are recommended. Avoid contamination of thermistor surface during handling. Bending / twisting leads A lead (wire) may be bent at a minimum distance of twice the wire's diameter plus 4 mm from the component head or housing. When bending ensure the wire is mechanically relieved at the component head or housing. The bending radius should be at least 0.75 mm. Twisting (torsion) by 180 of a lead bent by 90 is permissible at 6 mm from the bottom of the thermistor body. Soldering Use resin-type flux or non-activated flux. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. Complete removal of flux is recommended.
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Mounting Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral. Electrodes/contacts must not be scratched or damaged before/during/after the mounting process. Contacts and housing used for assembly with the thermistor must be clean before mounting. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. Avoid contamination of the thermistor surface during processing. The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to an environment with normal atmospheric conditions. Tensile forces on cables or leads must be avoided during mounting and operation. Bending or twisting of cables or leads directly on the thermistor body is not permissible. Avoid using chemical substances as mounting aids. It must be ensured that no water or other liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based substances (e.g. soap suds) must not be used as mounting aids for sensors. Operation Use thermistors only within the specified operating temperature range. Use thermistors only within the specified power range. Environmental conditions must not harm the thermistors. Only use the thermistors under normal atmospheric conditions or within the specified conditions. Contact of NTC thermistors with any liquids and solvents should be prevented. It must be ensured that no water enters the NTC thermistors (e.g. through plug terminals). For measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. Galden). Avoid dewing and condensation unless thermistor is specified for these conditions. Bending or twisting of cables and/or wires is not permissible during operation of the sensor in the application. Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and Important notes at the end of this document.
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Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Symbols and terms Symbol A AWG B B25/100 Cth I N P25 Pdiss Pel Pmax RB/RB Rins RP RR RR/RR RS RT T T t TA Tmax Tmin Top TR Tsurf V Vins Vop Vtest English Area American Wire Gauge B value B value determined by resistance measurement at 25 C and 100 C Heat capacitance Current Number (integer) Maximum power at 25 C Power dissipation Electrical power Maximum power within stated temperature range Resistance tolerance caused by spread of B value Insulation resistance Parallel resistance Rated resistance Resistance tolerance Series resistance Resistance at temperature T (e.g. R25 = resistance at 25 C) Temperature Temperature tolerance Time Ambient temperature Upper category temperature Lower category temperature Operating temperature Rated temperature Surface temperature Voltage Insulation test voltage Operating voltage Test voltage German Flache Amerikanische Norm fur Drahtquerschnitte B-Wert B-Wert, ermittelt durch Widerstandsmessungen bei 25 C und 100 C Warmekapazitat Strom Anzahl (ganzzahliger Wert) Maximale Leistung bei 25 C Verlustleistung Elektrische Leistung Maximale Leistung im angegebenenTemperaturbereich Widerstandstoleranz, die durch die Streuung des B-Wertes verursacht wird Isolationswiderstand Parallelwiderstand Nennwiderstand Widerstandstoleranz Serienwiderstand Widerstand bei Temperatur T (z.B. R25 = Widerstand bei 25 C) Temperatur Temperaturtoleranz Zeit Umgebungstemperatur Obere Grenztemperatur (Kategorietemperatur) Untere Grenztemperatur (Kategorietemperatur) Betriebstemperatur Nenntemperatur Oberflachentemperatur Spannung Isolationsprufspannung Betriebsspannung Prufspannung
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Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012)
B574**V2
Symbol th c a
English Temperature coefficient Tolerance, change Dissipation factor Thermal cooling time constant Thermal time constant
German Temperaturkoeffizient Toleranz, Anderung Warmeleitwert Thermische Abkuhlzeitkonstante Thermische Zeitkonstante
Abbreviations / Notes Symbol English Surface-mounted devices * + German Oberflachenmontierbares Bauelement
To be replaced by a number in ordering Platzhalter fur Zahl im Bestellnummerncodes, type designations etc. code oder fur die Typenbezeichnung. To be replaced by a letter. All dimensions are given in mm. The commas used in numerical values denote decimal points. Platzhalter fur einen Buchstaben. Alle Mae sind in mm angegeben. Verwendete Kommas in Zahlenwerten bezeichnen Dezimalpunkte.
Please read Cautions and warnings and Important notes at the end of this document.
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Important notes
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.
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